- RoHS compatible process
- Processes compliant to quality standards ISO 9001:2000 and TS 16949:2002
- Precise Quality
- Flexible production - from high mix low volumes projects up to medium and high series
- Customer support from design stage, prototyping and production
Offered Services
- design&development
- quotation
- material sourcing
- tooling realization
- testing process realization
- prototype&sample build
- cost optimalization
- series production
- customer satisfaction
Production Area
The production area is designed to fully comply with ESD environment, equipped with temerature and humidity control. The area is fully suitable for the most critical application production.
Production Storage Area
Components are transfered to the production from the main stock which is covering 2 500 sq meters. Production storage area set up is divided per the component cathegory. The whole stock is equiped with cystom made feeders in order to ensure the FIFO principal.
Technology
Our process is equiped with modern technology for SMT / THT assembly and for the following inspections of correct placement and soldering.
- 3 fully automatic SMT lines
- 1 semiautomatic SMT line
- 2 wave soldering machines
- AOI testing
- ICT testing
- Functional / High Voltage test
SMT Lines
Solder paste printing is done on Samsung SP450 V printer, fullz automatic equipment including 2D inspection. Screen printing stencils are centered in pneumatic frame, ensuring proper tension guarranteed high quality solder paste application.
Component assembly is done on pick&place equipment Samsung, currently using 2 Samsung CP 45 and 2 Samsung 63 Neo machines. Component range assembled is from 0201 package up to QFP 42mm, including BGA components. Current capacity allows to assemble approx. 350 000 components per shift.
Reflow soldering in 9 - zone Heller owens ensuring temperature stability and precise soldering profile set up. The stability of the soldering process is regurarly checked with the external calibration jig.
Apart from PCB Assembly TSE is having vast knowledge of populating flexible printed circuits, supported with many years of experience in this field. All the supporting tooling like soldering carriers and jigs are designed and manufactured in our own tool making workshop.
Part of the flexible printed circuit population is crimping process, applied directly onto the flex foil.
Wave soldering
Assembly and soldering of THT components is done in a segregated are using ERSA wave soldering equipment. Both leaded and lead free procesess are applied, Pb free soldering in Ni atmosphere.
AOI inspections / Repair Stations
Automatic Optical Inspections are conducted on Maranz and Mirtec equipment, which are SW connected directly to repair station. The AOI inspection will ensure correct orientation and soldering of the component, detecting dry joints and short circuits as well as providing data for the solderin process fine tuning.
Testing Area
We are offering ICT testing as well functional tests.
ICT testing is ensured by SPEA 3030. ICT fixtures are designed to customer needs, testing from standard ICT to single LED intensity and colour spectrum, but also applying mechanical checks within ICT.
When functional test is required, our team can design and produce functional test jigs or programming stations.
